Specifications |
Manufacturer |
AG TERMOPASTY |
Type of solder |
for soft soldering |
Appearance |
paste |
Alloy composition |
Sn96,5Ag3Cu0,5 |
Kind of solder |
lead free |
Kind of package |
syringe |
Grain size |
25...45µm |
Binder weight |
6g |
Melting point |
217°C |
Flux content |
12% |
Kind of flux |
halide-free, |
Signal word |
Warning |
Hazard statements |
H317: May cause an allergic skin reaction. |
Flux residues |
non-corrosive, |
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