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Heatsinks - Heatsink black finished L=25mm 16,6K/W for TO220
Heatsinks - Heatsink black finished L=25mm 16,6K/W for TO220
Final price: 1.04 €
     
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Heatsinks - Heatsink extruded, grilled, L 200mm, W 262mm, H 60mm, aluminium
Heatsinks - Heatsink extruded, grilled, L 200mm, W 262mm, H 60mm, aluminium
Final price: 43.47 €
     
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Heatsinks - Heatsink P22139 30mm

Prod code: 7868

RAD-P22139/30
Price:  0.58 €
VAT:  0.14 €
Final price with tax:  0.72 €
Amount:   
Warning Long delivery time
Specifications
Heatsink type extruded
Length 30mm
Width 30mm
Height 12mm
Dimensions  VIEW
 
Availability: With order
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Manufacturers: --- | ALUTRONIC | ANLY ELECTRONICS | FISCHER | FISCHER ELEKTRONIK | STONECOLD
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 Related categories: Heat transfer paste (4)  Heat transfer adheshive (3)  Insulator accessories (2)  
PASTA-CU-40 - Heat transferring paste on copper basis 40g 3.1W/mK
PASTA-CU-40 - Heat transferring paste on copper basis 40g 3.1W/mK

 TERMOGLUE-10 - Heat-transferring adhesives, white, Application heatsinks, 10g
TERMOGLUE-10 - Heat-transferring adhesives, white, Application heatsinks, 10g

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TERMOGLUE-120 - Heat-transferring adhesives, white, Application heatsinks, 120g
PASTA-SILH-25 - Heat transferring paste, white, silicon based, 25g
PASTA-SILH-25 - Heat transferring paste, white, silicon based, 25g

 PASTA-SILH-T7 - Heat transferring paste, white, silicon based, 7g
PASTA-SILH-T7 - Heat transferring paste, white, silicon based, 7g

 TT720-12MM-25M - Tape heat transfer, W 12mm, L 25m, D 0.2mm, 1W/mK, 6kV/mm, 7.1N/cm
TT720-12MM-25M - Tape heat transfer, W 12mm, L 25m, D 0.2mm, 1W/mK, 6kV/mm, 7.1N/cm
TT720-15MM-25M - Tape heat transfer, W 15mm, L 25m, D 0.2mm, 1W/mK, 6kV/mm, 7.1N/cm
TT720-15MM-25M - Tape heat transfer, W 15mm, L 25m, D 0.2mm, 1W/mK, 6kV/mm, 7.1N/cm

 PASTA-SILH-1000 - Heat transfer paste, white, silicon based, 1kg
PASTA-SILH-1000 - Heat transfer paste, white, silicon based, 1kg

 LOC-315 - Heat transfer glue, 25ml
LOC-315 - Heat transfer glue, 25ml
  Thursday 21 November, 2024     126338963 requests since Saturday 23 January, 2010  
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